2021011814475422091
2021011814475422091

2.0W/m.k two-component thermal conductive gel

2.0W/m.k two-component thermal conductive gel
Thermal conductivity :2.0W/m.k
Operation temperature :-40-200℃
Two component, high thermal conductivity silicone gel
Medium viscosity, naturally sticky surface after curing
Complies with EU ROHS and REACH directives
Thermal conductivity :2.0W/m.k
Operation temperature :-40-200℃
Two component, high thermal conductivity silicone gel
Medium viscosity, naturally sticky surface after curing
Complies with EU ROHS and REACH directives
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2.0W/m.k two-component thermal conductive gel Apply For Quotation
Product Introduction
2.0W/m.kTwo component thermal conductive gel isTuqise is a soft silicone based thermal conductive gap filling material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerance. The thermal conductive gel mainly meets the requirements of low stress and high compression modulus when the product is used, and can realize automatic production; Good contact with electronic products during assembly, exhibiting low contact thermal resistance and good electrical insulation characteristics. The cured thermal conductive gel is equivalent to the thermal conductive gasket, which has good high temperature resistance and aging resistance, and can work at - 40~200 ℃ for a long time. It is filled with Between electronic components and heat sinks/shells that require cooling, making them in close contact, reducing thermal resistance, quickly and effectively reducing the temperature of electronic components, thereby extending the service life of electronic components and improving their reliability. Thermal conductive gel can be coated manually or by dispensing equipment.
Characteristics and advantages
High thermal conductivity, low thermal resistance, excellent wettability
Soft, stress free, can be infinitely compressed to a minimum thickness of 0.1mm
No settlement, no flow, can fill any uneven gap
Convenient design and application, combined with an automatic dispensing machine, can adjust any thickness size
Meet ROHS and UL environmental requirements
Application method

Between semiconductor and heat sink

Between electronic components and heat sinks/shells that require cooling

Application area
Base station, new energy vehicle, LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor field
Product Property Table

Attribute

Parameter

Test method

Part

Silicone& ceramics

-

Color/Component A

White

Visualization

Color/Component B

Grey

Visualization

Viscosity/Component A(CPS)

350000

ASTM D2196

Viscosity/Component B(CPS)

400000

ASTM D2196

Mixing ratio

1:1

-

Density(g/cc)

2.7

ASTM D792

Hardness after curing(Shore 00)

50

 

Temperature resistance range( ℃)

-40~200

-40~200

Breakdown voltage(Kv/mm)

7.0

ASTM D149

Volume resistivity(Ω*cm)

9.0*10^13

ASTM D257

Dielectric constant(10@MHz)

6.8

ASTM D150

Fire rating

V-0

UL 94

Thermal conductivity characteristics after curing

 

 

Thermal conductivity coefficient(W/m.k)

2.0

ASTM D5470

Quality guarantee period

12 months

-

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