Between semiconductor and heat sink
Between electronic components and heat sinks/shells that require cooling
Attribute |
Parameter |
Test method |
Part |
Silicone& ceramics |
- |
Color/Component A |
White |
Visualization |
Color/Component B |
Grey |
Visualization |
Viscosity/Component A(CPS) |
350000 |
ASTM D2196 |
Viscosity/Component B(CPS) |
400000 |
ASTM D2196 |
Mixing ratio |
1:1 |
- |
Density(g/cc) |
2.7 |
ASTM D792 |
Hardness after curing(Shore 00) |
50 |
|
Temperature resistance range( ℃) |
-40~200 |
-40~200 |
Breakdown voltage(Kv/mm) |
≥7.0 |
ASTM D149 |
Volume resistivity(Ω*cm) |
9.0*10^13 |
ASTM D257 |
Dielectric constant(10@MHz) |
6.8 |
ASTM D150 |
Fire rating |
V-0 |
UL 94 |
Thermal conductivity characteristics after curing |
|
|
Thermal conductivity coefficient(W/m.k) |
2.0 |
ASTM D5470 |
Quality guarantee period |
12 months |
- |