2.0W/m.k two-component thermal conductive gel

Thermal conductivity ：2.0W/m.k
Operation temperature ：-40-200℃
Two component, high thermal conductivity silicone gel
Medium viscosity, naturally sticky surface after curing
Complies with EU ROHS and REACH directives

Product Introduction

2.0W/m.kTwo component thermal conductive gel isTuqise is a soft silicone based thermal conductive gap filling material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerance. The thermal conductive gel mainly meets the requirements of low stress and high compression modulus when the product is used, and can realize automatic production; Good contact with electronic products during assembly, exhibiting low contact thermal resistance and good electrical insulation characteristics. The cured thermal conductive gel is equivalent to the thermal conductive gasket, which has good high temperature resistance and aging resistance, and can work at - 40~200 ℃ for a long time. It is filled with Between electronic components and heat sinks/shells that require cooling, making them in close contact, reducing thermal resistance, quickly and effectively reducing the temperature of electronic components, thereby extending the service life of electronic components and improving their reliability. Thermal conductive gel can be coated manually or by dispensing equipment.

Characteristics and advantages

High thermal conductivity, low thermal resistance, excellent wettability
Soft, stress free, can be infinitely compressed to a minimum thickness of 0.1mm
No settlement, no flow, can fill any uneven gap
Convenient design and application, combined with an automatic dispensing machine, can adjust any thickness size
Meet ROHS and UL environmental requirements

Application method

Between semiconductor and heat sink

Between electronic components and heat sinks/shells that require cooling

Application area

Base station, new energy vehicle, LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor field

Product Property Table

Attribute	Parameter	Test method
Part	Silicone& ceramics	-
Color/Component A	White	Visualization
Color/Component B	Grey	Visualization
Viscosity/Component A（CPS）	350000	ASTM D2196
Viscosity/Component B（CPS）	400000	ASTM D2196
Mixing ratio	1:1	-
Density（g/cc)	2.7	ASTM D792
Hardness after curing（Shore 00）	50
Temperature resistance range（ ℃）	-40~200	-40~200
Breakdown voltage（Kv/mm）	≥7.0	ASTM D149
Volume resistivity（Ω*cm）	9.0*10^13	ASTM D257
Dielectric constant（10@MHz）	6.8	ASTM D150
Fire rating	V-0	UL 94
Thermal conductivity characteristics after curing
Thermal conductivity coefficient（W/m.k）	2.0	ASTM D5470
Quality guarantee period	12 months	-