Filling between circuit board and heat sink;
Filling between IC and heat sink or product casing。
Characteristic |
Metric value |
Test method |
Thickness(mm) |
0.3-15MM |
ASTM D374 |
Component |
Silica gel&Ceramics |
-- |
Colour |
Blue |
Visuai |
HardnessshoreC |
30±5 |
ASTM D2240 |
Densityg/cm3 |
2.6±0.1 |
ASTM D792 |
Tear strengthKN/m |
0.3 |
ASTM D412 |
Elongation rate% |
70 |
ASTM D374 |
Temperature resistance range℃ |
-40—200 |
EN344 |
Breakdown voltageKv |
>10 |
ASTM D149 |
Volume resistivityΩ·cm |
1.5×1012 |
ASTM D257 |
Dielectric constant@1MHz |
6.0 |
ASTM D150 |
Weight loss% |
<2.5 |
@200℃240H |
Fire performance |
V—0 |
UL-94 |
Thermal conductivity W/m.k |
2.0 |
ASTM D5470 |