The NF400 thermal conductivity and heat dissipation silica gel sheet is made by special processing using silica gel and thermal conductivity Ceramics fillers. It is self-adhesive on both sides and exhibits good thermal conductivity and electrical insulation performance under low pressure shrinkage. Stable operation can be achieved between -40 ℃ and 200 ℃, meeting the Flame retardant grade requirements of UL94V0.
High thermal conductivity rate;
Thermal conductivity :4.0W/m.k;
High compressibility, soft and elastic;
Natural viscosity, double-sided self-adhesive, without the need for additional surface adhesive, meeting the environmental requirements of ROHS and UL。Filling between circuit board and heat sink;
Filling between IC and heat sink or product casing。
Characteristic |
Metric value |
Test method |
Thickness(mm) |
0.3-10MM |
ASTM D374 |
Component |
Silica gel&Ceramics |
-- |
Colour |
红&Grey |
Visuai |
HardnessshoreC |
30±5 |
ASTM D2240 |
Densityg/cm3 |
3.1±0.1 |
ASTM D792 |
Tear strengthKN/m |
0.1 |
ASTM D412 |
Elongation rate% |
50 |
ASTM D374 |
Temperature resistance range℃ |
-40—200 |
EN344 |
Breakdown voltageKv |
>7 |
ASTM D149 |
Volume resistivityΩ·cm |
1.5×1011 |
ASTM D257 |
Dielectric constant@1MHz |
7.4 |
ASTM D150 |
Weight loss% |
2 |
@200℃240H |
Fire performance |
V—0 |
UL-94 |
Thermal conductivity W/m.k |
4.0 |
ASTM D5470 |