2021011814475422091
2021011814475422091

2.0W/m.k single component thermal conductive gel

2.0W/m.k single component thermal conductive gel
Thermal conductivity :2.0W/m.k
Operation temperature :-40-200℃
Non curing, high reliability
One component, high thermal conductivity silicone gel
Complies with EU ROHS and REACH directives
Thermal conductivity :2.0W/m.k
Operation temperature :-40-200℃
Non curing, high reliability
One component, high thermal conductivity silicone gel
Complies with EU ROHS and REACH directives
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2.0W/m.k single component thermal conductive gel Apply For Quotation
Product Introduction
HKOPUTE2.0W/m.kOne component thermal conductive gelIt is a paste like gap filled thermal conductive material, shaped according to the structural shape; For uneven ceramic, radiator surfaces, or irregular cavities, it has excellent structural applicability and surface adhesion characteristics of structural components, with sufficient gap filling; Having good insulation and voltage resistance characteristics and temperature stability, safe and reliable use; Apply pressure like thermal conductive silicone grease to flow; Under the action of thermal cycling, it has high reliability and will not solidify.
Characteristics and advantages
Single component use
Will not solidify, high reliability
Good mechanical performance and weather resistance
The application effect of irregular structural gaps is good
Good electrical insulation to meet the needs of electronic devices
Application method

LEDDisplay backlight tube
Bottom or frame of radiator
High speed hard drive
Micro heat pipe radiator
Automotive engine control device
Semiconductor automatic testing equipment

Application area
Communication equipment, network terminals, storage devices, LED lighting fixtures, consumer electronics, power devices, security equipment, instruments and meters, electrical engineering, automotive electronics
Product Property Table
Test items Unit Test result Test method
Part - Silicone& Thermal conductive powder -
Colour - Pink Visual
Proportion g/m3 2.41 ASTM D1475
Thermal Impedance ℃*in2/W 0.15 ASTM D5470
Extrusion rate g/min 30±5 2.54mm 90psi
Weight loss % <0.5 @200℃240H
Volume resistivity Ω·cm >1*1013 ASTM D257
Temperature resistance range -40~200 EN344
Minimum interface thickness mm 0.09 -
Flame retardancy - V-0 UL 94
Thermal conductivity W/m.k 2.0  ASTM D5470
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