LED, as the fourth generation lighting,
with characteristics of energy conversation, environmental, longevity,
compact, is now widely used in various fields such as lighting.
displaying,piloting, decoration, backlight and so on.
At present , LED electro-optic conversion
efficiency is only about 20-30%,about other 70% energy is turned into
heat.That is why there is urgent desire in LED heat dissipation.
Electrons combining holes can only
engender approximate 90% photons. Current leakage reduces the
recombination efficiency in PN region, the leakage current multiplied by
the voltage is the power of this part,which is converted into heat.
Not like 15lm/w incandescent lamp
converting almost all electric into light and eliminating the heat
dissipation problem,only 30% of the internal photons of LED can be
emitted to the chip and others finally converted into heat.
LED chip will generate extremely
excessive heat in limited space, surmount its heat capacity, this
requires efficient heat conduction avoid junction temperature
occurrence.
Continuous high temperature of LED lamp
caused by working chip, will impact on its service life and stability
seriously.the lower the luminous rate brings the higher temperature.
This confusing attracts more and more
attention Shenzhen Opute Electronic technology Co.,LTD has successively
developed allround-performance ,user-friendly targeted products for LED
market.
In order to satisfying mutiple scenarios users, Opute silicone thermal pad series have various structure, besides taking glass fiber and silicon
fabric as reinforcement carrier, designing both single and double sided
adhesive to fasten PCB and radiator.