Thermal conductive silicone sheet is a high-performance gap filled thermal conductive material mainly used for the transfer interface between electronic devices and heat sinks or product shells. NF100 has good viscosity, flexibility, good compression performance and excellent heat conductivity. Make it possible to completely exhaust the air between the electronic components and the heat sink during use, in order to achieve sufficient contact. The heat dissipation effect is significantly increased. At the same time, it has a certain degree of viscosity, which brings great convenience in the installation process of the product compared to ordinary insulation and thermal conductive materials. It is not easy to fall off and is easy to operate.
High reliability;
High thermal conductivity rate;
Thermal conductivity :1.0W/m.k;
High compressibility, soft and elastic;
Natural viscosity, double-sided self-adhesive, without the need for additional surface adhesive, meeting the environmental requirements of ROHS and UL。
Filling between circuit board and heat sink;
Filling between IC and heat sink or product casing。
Characteristic |
Metric value |
Test method |
Thickness(mm) |
0.3-15MM |
ASTM D374 |
Component |
Silicone& ceramics |
-- |
Colour |
灰/White |
Visuai |
HardnessshoreC |
30±5 |
ASTM D2240 |
Densityg/cm3 |
1.8±0.1 |
ASTM D792 |
Tear strengthKN/m |
0.2 |
ASTM D412 |
Elongation rate% |
100 |
ASTM D374 |
Temperature resistance range℃ |
-40—200 |
EN344 |
Breakdown voltageKv |
3 |
ASTM D149 |
Volume resistivityΩ·cm |
1.5×1012 |
ASTM D257 |
Dielectric constant@1MHz |
3.5 |
ASTM D150 |
Weight loss% |
<3 |
@200℃240H |
Fire performance |
V—0 |
UL-94 |
Thermal conductivity W/m.k |
1.0 |
ASTM D5470 |