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2.5W/m.k thermal conductive silicone grease

2.5W/m.k thermal conductive silicone grease
Thermal conductivity :2.5W/m.k
Thermal Impedance:<<0.126℃-in2/W
Temperature resistance range:-40-200℃
Complies with EU ROHS and REACH directives
Can replace the same type of thermal conductive silicone grease
Thermal conductivity :2.5W/m.k
Thermal Impedance:<<0.126℃-in2/W
Temperature resistance range:-40-200℃
Complies with EU ROHS and REACH directives
Can replace the same type of thermal conductive silicone grease
Contact Us
2.5W/m.k thermal conductive silicone grease Apply For Quotation
Product Introduction
HKOPUTE2.5W/m.k thermal conductive silicone grease is a thermal conductive organic silicone like composite made from organic silicone as the main raw material, adding materials with excellent heat resistance and thermal conductivity. It has good thermal conductivity, temperature resistance, and insulation performance, making it an ideal dielectric material for heat-resistant devices. Moreover, its performance is stable, and it will not produce corrosive gases during use and will not affect the metal in contact. High purity fillers and organic silicon ensure smooth, uniform, and high-temperature insulation of the product. Apply to the assembly surface of power devices and heat sinks to help eliminate air gaps on the contact surface, increase heat flux, reduce thermal resistance, reduce the operation temperature of power devices, improve high reliability, and extend service life.
Characteristics and advantages
1.Good thixotropy, easy to use, economical and practical, simple coating or potting process;
2.Better thermal conductivity, lower evaporation loss and oil separation, non flowing at high temperatures;
3.Excellent insulation performance, non-toxic, non curing, non corrosive to the substrate, and stable chemical properties;
4.Resistant to water, ozone, and climate aging, and can be used for a long time at temperatures ranging from -40 ℃ to 200 ℃. Conform to the standards and REACH requirements required by EU RoHS。
Application method
Between semiconductor and heat sink
 Between CPU and heat sink
Between the power resistor and the base
Thermoelectric cooling device
Temperature regulator and mounting surface
Application area
1.Used for heat conduction and dissipation of electronic raw materials such as power amplifiers, transistors, electronic tubes, CPUs, etc;
2.Base and stud installation for transistors, diodes, and silicon controlled rectifiers;
3.A medium used to form a layer of heat transfer on a heating tube. For example, irons, hair straighteners, heat pipes in coffee pots, etc;
4.Widely used in televisions, water dispensers (ice cans), induction cookers, coffee machines, refrigerators; Sound (power amplification); Thermistor; Radiator; CPU fan; Baking ovens, etc。
Product Property Table

Project

Unit

Environment

Test method

Test result

Colour

-

25℃

Visual

gray/Grey

Thermal Impedance

℃-in2/W

25℃

ASTM D1470

<0.126

Proportion    

-

25℃

ASTMD1475

>2.3

Evaporation capacity

%

150℃/24Hours

Fed.Std.791

<0.001

Oil precipitation

%

150℃/24Hours

Fed.Std.791

<0.05

Insulation constant

-

100Hz

ASTM D150

>5

Viscosity

-

25℃

-

No-flow

Cone penetration

1/10 mm

25℃

GB/T-269

410±10

Instantaneous temperature resistance

-

-

-50~330℃

Operation temperature Range

-

-

-20~200℃

Thermal conductivity coefficient

W/m.k

-

ASTM D5470

> 2.5

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